WarmzBord SLIM

Slim is the go-to choice for retrofit projects where floor build-up must be kept to an absolute minimum.

At just 22mm overall depth, it combines a pre-insulated base panel - cutting downward heat loss by over 70% compared to gypsum/cement overlay systems, with routed pipe channels that fully protect the pipework during installation. Once the pipe is laid, a 6mm fast-response HeatSkin cover board is bonded to the Base.

The conductive HeatSkin cover uses a thick, soft-temper 200-micron aluminium diffuser, giving Slim exceptionally fast warm-up times - more than twice as fast as gypsum/cement overlays, together with high heat output and strong compatibility with low-temperature heat pumps.

Our patent-pending PipeSure® technology prints the exact pipe position on the HeatSkin surface, enabling safe fixing and precise installation every time.

Slim is lightweight, robust, moisture-resistant, and compatible with all common floor finishes. It’s a future-ready upgrade for existing homes, delivering heat-pump-friendly performance without compromising ceiling height or comfort.